Overview
Description
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. Its products include SiP, PBGA, FCCSP, CSP, RF modules, and FCBGA. The firm offers plastic ball grid arrays, wire bond chip-scale package, cavity down, system-in-package, flip chip, radio frequency module, chip on board light-emitting diode, and chip-on-film. The company was founded on September 11, 2000 and is headquartered in Taoyuan, Taiwan.
Technology Electronic Components and Manufacturing Manufacturing Equipment and Services Taiwan
Financials
Key metrics
| Market capitalisation, EUR | 11,488 m |
| EPS, EUR | 0.16 |
| P/B ratio | 9.6 |
| P/E ratio | 139.2 |
| Dividend yield | 0.19% |
Income statement (2025)
| Revenue, EUR | 1,121 m |
| Net income, EUR | 45 m |
| Profit margin | 4.06% |
What ETF is Kinsus Interconnect Technology Corp. in?
There are 25 ETFs which contain Kinsus Interconnect Technology Corp.. All of these ETFs are listed in the table below. The ETF with the largest weighting of Kinsus Interconnect Technology Corp. is the First Trust Emerging Markets AlphaDEX UCITS ETF Acc.
— Data provided by Trackinsight, etfinfo, Xignite Inc., gettex, FactSet and justETF GmbH. Quotes are either real-time (gettex) or 15 minutes delayed stock exchange quotes or NAVs (daily published by the fund provider). By default, ETF returns include dividend payments (if applicable). There is no warranty for completeness, accuracy and correctness for the displayed information.
