Kinsus Interconnect Technology Corp.

ISIN TW0003189007

 | 

WKN A0ETRF

Market cap (in EUR)
10,528 m
Country
Taiwan
Sector
Non-Energy Materials
Dividend yield
0.13%
 

Overview

Description

Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. It specializes in plastic ball grid array, wire bond chip-scale package, cavity down, system-in-package, flip chip, radio frequency module, chip on board light-emitting diode, and chip-on-film. The company was founded on September 11, 2000 and is headquartered in Taoyuan, Taiwan.
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Non-Energy Materials Chemical, Plastic and Rubber Materials Specialty and Performance Chemicals Taiwan

Financials

Key metrics

Market capitalisation, EUR 10,528 m
EPS, EUR 0.11
P/B ratio 8.8
P/E ratio 182.2
Dividend yield 0.13%

Income statement (2025)

Revenue, EUR 1,121 m
Net income, EUR 45 m
Profit margin 4.06%

What ETF is Kinsus Interconnect Technology Corp. in?

There are 4 ETFs which contain Kinsus Interconnect Technology Corp.. All of these ETFs are listed in the table below. The ETF with the largest weighting of Kinsus Interconnect Technology Corp. is the iShares MSCI Emerging Markets Small Cap UCITS ETF.
ETF Weight Investment focus Fund size (in m EUR)
iShares MSCI Emerging Markets Small Cap UCITS ETF 0.32%
Equity
Emerging Markets
Small Cap
322
Vanguard ESG Global All Cap UCITS ETF (USD) Distributing 0.01%
Equity
World
Social/Environmental
597
Vanguard ESG Emerging Markets All Cap UCITS ETF (USD) Distributing 0.05%
Equity
Emerging Markets
Social/Environmental
20
iShares MSCI EM IMI Screened UCITS ETF USD (Dist) 0.04%
Equity
Emerging Markets
Social/Environmental
1,311
— Data provided by Trackinsight, etfinfo, Xignite Inc., gettex, FactSet and justETF GmbH.

Quotes are either real-time (gettex) or 15 minutes delayed stock exchange quotes or NAVs (daily published by the fund provider). By default, ETF returns include dividend payments (if applicable). There is no warranty for completeness, accuracy and correctness for the displayed information.