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Winbond Electronics Corp.
ISIN TW0002344009
|WKN 898047
Market cap (in EUR)
25,584 m
Country
Taiwan
Sector
Technology
Dividend yield
0.24%
Overview
Description
Winbond Electronics Corp. engages in the business of designing, development, manufacturing, and marketing of Very Large Scale Integration (VLSI) integrated circuits (ICs) used in a variety of microelectronic applications. It operates through the following segments: DRAM IC, Flash Memory, and Logic IC Products. The DRAM IC Product segment includes mobile and specialty RAM. The Flash Memory Product segment offers production, sales, research, design, and after-sales service of the flash memory products. The Logic IC Product segment focuses on Logic IC products. The company was founded on September 29, 1987 and is headquartered in Taichung, Taiwan.
Technology Electronic Components and Manufacturing Semiconductor Manufacturing Taiwan
Financials
Key metrics
| Market capitalisation, EUR | 25,584 m |
| EPS, EUR | 0.09 |
| P/B ratio | 7.9 |
| P/E ratio | 60.8 |
| Dividend yield | 0.24% |
Income statement (2025)
| Revenue, EUR | 2,547 m |
| Net income, EUR | 113 m |
| Profit margin | 4.43% |
What ETF is Winbond Electronics Corp. in?
There are 16 ETFs which contain Winbond Electronics Corp.. All of these ETFs are listed in the table below. The ETF with the largest weighting of Winbond Electronics Corp. is the iShares MSCI Emerging Markets Small Cap UCITS ETF.
Latest articles
— Data provided by Trackinsight, etfinfo, Xignite Inc., gettex, FactSet and justETF GmbH. Quotes are either real-time (gettex) or 15 minutes delayed stock exchange quotes or NAVs (daily published by the fund provider). By default, ETF returns include dividend payments (if applicable). There is no warranty for completeness, accuracy and correctness for the displayed information.